Through the proper configuration of two OZip-DC/DC Intelligent Power Modules, it is possible to transfer energy between two DC power sources with overlapping voltage ranges.  In this configuration the DC-DC Converters are connected “back-to-back” such that they share a common, intermediary rail voltage.  The following figure illustrates a “Back-to-Back” Buck-Boost DC/DC converter. 

The OZSCR2000 is our latest SCR Firing and Control board offering, built upon the successful OZSCR1000 digital control platform. This second generation controller uses a Texas Instruments Piccolo processor, and provides all the original digital control features, including:

Traditionally, grid energy storage systems (ESS) have been one-off solutions, utilizing proprietary software and hardware components.  As such, each installation requires time consuming, custom integration.  Often times proprietary vendor hardware or software protocols require "hacks" to get all components to play nice.  Ultimately this approach results in higher costs, decreased reliability, and limited scalability and upgrade options.

In remote locations where the traditional utility power grid is inaccessible, standalone microgrids, powered by renewable energies like solar and wind turbines, are playing a crucial role in generating electricity for the local community. In addition to generating power to meet the electricity needs of islands and remote communities across the world, microgrids also see application within conventional power grid locations by helping utilities in times of outages by delivering reliable power to neighborhoods, hospitals and mission critical buildings.

There is no doubt that operating environment has a major effect on the life and reliability of electronic assemblies.  Power electronics in particular are perhaps most susceptible to life and reliability degradation, as there are usually several components within the system whose losses all conspire to raise the operating temperature.  Losses include switching and conduction losses in semiconductor devices as well as losses in passive components such as magnetics, filter damping resistors, and bus bars.